ADVANCED THERMAL MANAGEMENT PRODUCT APPLICATIONS

Advanced Thermal Management Product Applications

Thermal Armor^TM is SmartEnergi’s superior thermal interface material (TMI) made from nanostructured material that isolates electrical components from the heat sink, and at the same time rapidly conducts heat away from the electrical components (processors, etc) to the heat sink or other cooling solution such as heat spreaders. By facilitating heat dissipation, they prevent devices from overheating, which is crucial for preventing poor device performance and instantaneous failure. As a result, devices using Thermal Armor^TM can expect to operate better, and be protected from catastrophic heat.

What Thermal Armor^TM Offers?

Existing thermal interface material includes thermal greases, thermal pads, phase change materials, and thermal adhesives, each designed to address specific heat management for different applications. What they have in common is relatively slow heat conduction to the heat spreader or heat sink. As a result, in spite of the presence of these conventional TMI, the devices being cooled still experience hot spots that could lead to device malfunction or catastrophic failure.

rapidly conduct the heat from critical electronic component

SmartEnergi’s Thermal Armour^TM uses binderless nanostructured material as a key ingredient, allowing us to rapidly conduct the heat from critical electronic component to the heat spreader or heat sink. Benefits:

Improved heat dissipation, preventing thermal issues in devices.
Enhanced device reliability and lifespan.
Increased safety, especially for batteries.
Improved overall device performance.
Cost-effective, as it eliminates the need for traditional thermal management components.

SELECTED USE CASES

Some TMI use cases where Thermal Armour^TM offers superior solution include:

Thermal Management in Compact Devices

In compact electronic devices like laptops and smartphones, space for heat dissipation is limited. Conventional TIMs provide a means of transferring heat from the electronic components to the device's outer surface or cooling system. However, due to the relative heat transfer inefficiency of these TMIs, these compact electronics tend to experience elevated surface temperature. Using SmartEnergi’s Thermal Armor^TM, devices can be cooled faster, eliminate incidence of hot spots and improve device performance and longevity.

ADVANCED THERMAL MANAGEMENT PRODUCT APPLICATIONS